Software controls for electroplating equipment

Process Partners provides exceptional software control systems for electroplating equipment, whether you’re in the semiconductor, solar, wire, PCB or wafer industry. Our software has been continually refined and updated for 12 years and runs on hundreds of systems in a variety of industries, making it incredibly stable and reliable. Software control systems include:

AutomOtion 8000

AutoMotion 8000 provides general purpose as well as industry and machine specific interfaces for electroplating equipment. Learn more...

AccuPlate 3D™

AccuPlate 3D™ provides complete electroplating cell understanding that can help design and optimize electroplating equipment, improve plating deposit uniformity, increase plating speed, save plated metal, and improve overall product quality. Learn more...

MaxRacks

With accelerated simulation MaxRacks helps determine the maximum throughput of a pick-and-place wet process system. Learn more...

AutomOtion 8000: interfacing with the machine

automation 8000The AutoMotion Suite provides general purpose as well as industry and machine specific interfaces for our electroplating equipment. Machine specific interfaces include: hoist/pick and place, reel to reel, high-speed wire, wide web process (roll to roll), and manual wet benches.

Reporting Tools

Robust reporting tools for your electroplating processes include:

  • Historical trending
  • Batch reporting
  • Event ogging
  • Third party SPC compatibility
  • Open database formats

Control systems

Control systems include:

  • PLC control
  • OPC Interface
  • Allen-Bradley, Omron, Mitsubishi, Siemens, etc.
  • PC control
  • Motion control: 2-3 axis robots and hoists

See control systems for more information

Scheduling

  • Random-loading, dynamic hoist scheduler
  • HMI integrated or stand-alone
  • PC version and PLC version
  • Simulator

Custom software for automotion

  • Motion control
  • Process control
  • Recipes
  • SCADA
  • HMIs
  • OPC servers
  • Trending
  • SPC

Other features include:

  • Parts database
  • Recipe database
  • Customization options for the end user
  • Microsoft Windows platform compatibility
  • Network support
  • Service and support from a remote location

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AccuPlate 3D™: Complete electroplating cell understanding

accuplateAccuPlate 3D™ is a revolutionary new application utilizing CAD, interactive solids modeling, 3D geometry, and chemical data management. AccuPlate 3D™ provides complete electroplating cell understanding that can help design and optimize electroplating equipment, improve plating deposit uniformity, increase plating speed, save plated metal, and improve product quality. AccuPlate 3D™ can be incorporated into current and future DFM technologies, decreasing the time-to-market cycle of new designs. Process improvements may be made which bypass costly trial and error plating cell design, set-up, and validation. This can be especially useful for quick-turn manufacturers, for products such as printed circuit boards.

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MaxRacks: Determine maximum throughput

maxracksMaxRacks is an accelerated simulation program for determining the maximum throughput of a pick-and-place wet process system. MaxRacks evaluates the soak time for each station and the time required for the hoist(s) to transfer loads. You can adjust these parameters to find the optimum system setup.

The simulation is done in three steps:

  • Enumerating the stations
  • Selecting the number of hoists and setting their speed capabilities
  • Assigning the racks and/or barrels a sequence to follow along with soak time, priority, and drip time

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software control